Hello how can i contact u personally? In my phone have a network problem some times come sometimes not. I diagnose board and i jumper it also but not much helped only those network are coming which are strong. So i want to share pictures of my phone pcb so that u can help. PCB file extension Information that help open, edit, and convert.PCB file. When there is a problem with opening files with the extension.PCB you do not need to immediately use the services of the IT expert. In most cases, using the helpful suggestions of experts contained in our website as well as appropriate programs you can solve the problem with the.PCB file yourself.

• How To Open Pcb File On Phone Screen
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In the File Transfer window on the tablet, touch the Accept button. The file is sent from your Mac to the Android tablet. It appears in a list of Bluetooth Inbound Transfers. You can touch the file in the Inbound Transfers window to open it and do whatever interesting thing that the tablet wants to do with that file. The manufacture of your board depends upon you supplying complete and accurate information in your PCB design file. Learn about the essentials for PCB design files. Although, being challenged as the Printed Circuit Board file standard Gerber files are still the most used format. Learn about the advantages and disadvantages of Gerber files. Once connected, open a Finder window at any time and click iPhone (or whatever you named your device) to access its photos and other files. How to Transfer Photos From Your iPhone to a PC Moving pictures from an iPhone to a PC isn't too difficult, but there are a couple of additional steps.

Up to now, smart phones have become such a must-have electronic product that more than one third of daily communications and activities are completed through smart phones with their value rapidly rising every year. It's estimated that mobile phones featuring language will be decreased as a rate of 23.5% by 2020. Contrarily, smart phones at all levels will maintain a growth trend of 8.0% by 2020, including low-cost and low-functioning smart phones, medium smart phones and high-end smart phones.

Apart from ordinary functions like voice communication and emailing, smart phones today should conform to functions that are equivalent to PCs' including webpage browsing, online communication and service and social media etc. Furthermore, the latest operation system allows smart phone users to easily download windows with particular functions and multi-media self-customized software and smart phones today are even capable of connecting with smart watches, PCs, home appliances and on-board equipment to meet more demands of people. When it comes to appearance and dimensions, smart phones will develop towards large scale but thinness. In the future, smart phones with thickness less than 8mm will become a main stream. Monitors move to high definition (HD) and large screen. The equipped camera will be upgraded from 16-million pixels to 20-million pixels. Besides the expected modifications introduced above, other specification modifications of smart phones are summarized into table below.

Based on functions and development trend of future smart phones, highly multi-layer printed circuit boards should be applied as mother board and low multi-layer PCBs as complementary daughter board. When it comes to the fabrication of mother boards, 10-layer build-up multilayer (BUM) PCBs are usually selected. Owing to function integration led by semiconductor packaging (SiP), it's extremely likely that layer count will maintain unchanged or even reduced. Since the year of 2015 witnessed the application of 64-bit processor and IC pin spacing has been shrinked from 0.4mm to 0.35mm, layer count of mother board will possibly increase to 12 layers or more for the time being. The development trend of board structure and distribution in smart phones are summarized in the following table.

How To Open Pcb File On Phone Screen

Technological design of PCB is so important that it plays a key role in manufacturing PCBs effectively with low cost. A new generation of surface mount technology (SMT) requires that designers have to take manufacturing issues into consideration from the beginning due to its complexity since a little modification of design files will definitely lead to delayed production time and increased development cost. Even a change of a pad position requires rerouting and solder paste stencil remanufacturing. The situation becomes tougher for analog circuits that strive for both redesigning and retesting. Nevertheless, if issues maintain unsolved, more loss will be caused in volume production in the end. Therefore, designers must pay full attention to technological issues from the beginning. One simple rule: the earlier technological issues are solved, the more beneficial it'll be for manufacturers.

Elements that should be taken into account in terms of technological design of smart phone circuit boards include:
• Transmission line, positioning hole and fiducial marks compatible with automatic manufacturing and assembly;
• Panels associated with manufacturing efficiency;
• PCB material, PCBA method, component distribution & packaging type, pad design and soldermask design related to soldering percent of pass;
• Component spacing and test pad design connected with inspection, rework and testing;
• Silkscreen or corrosion characters associated with assembly, debugging and wiring.

a. Laminate multilayer PCB

Laminate multilayer PCB fabrication technology is a type of multilayer PCB fabrication technology that is currently being widely applied. During the application of laminate multilayer PCB fabrication technology, substractive process is applied to manufacture circuit layer. Interconnection between layers is achieved through stages of lamination, mechanical drilling, electroless copper and copper plating. Finally come solder mask, solder coating and silkscreen to complete a piece of circuit board.

b. BUM technology

On insulating substrate board or traditional double-sided or multi-layer board, coated insulating dielectric is applied to form leads and through holes through chemical copper plating and electrical copper plating. The process continues over and over again until multilayer PCB with demanded layer count is finally manufactured. The optimal feature of BUM PCB is that substrate layer is so thin, trace width and spacing so low and via diameter so small that it features so high density. Thus, it can be applied in IC-grade high-density packaging.

c. Fiducial marks

As a generally-accepted rule, each side of daughter board in smart phones should have at least 2 fiducial marks. When space is actually so limited, they can be flexibly arranged. They should be designed to be a circular graphic whose diameter is 1mm (40mil). With contrast between material color and environment, solder mask area should be left 1mm (40mil) larger than fiducial marks and no character is allowed. When real estate is so limited, size of solder mask area can be arranged to be 0.5mm wider but solder pads with the same color shouldn't be designed within a range of 3mm.

Additionally, fiducial marks on the same board should feature the same internal background, that is, they should keep compatible in copper coating. A lonely fiducial mark with no routing around should be designed to be a protective circle with an internal diameter of 3mm and circular width 1mm. Moreover, coordinate figures must be featured by fiducial marks that shouldn't be regarded as a sign after PCB design.

d. Panel Design

• Double-side v-groove panel method works well for square PCBs with attributes of neat margins after breaking up and low manufacturing cost. Thus, it is firstly suggested. Generally, an angle of 30 degrees is applied with its thickness to be one fourth or third of board thickness. However, this method doesn't fit for printed circuit boards with ICs with BGA or QFN packages.

• Long-slot hole plus circular hole must be applied in mother boards with more than 4 layers while other daughter boards such as button board, LCD board, SIM card board and TF card board should select panel method based on the figure and shape of printed circuit boards. It's suggested that long-slot hole plus circular hole should be applied to arc or irregular shapes. Our article of The Surprising Secret to Designing Combination Method of PCB Panels will tell you more combination methods in terms of panel design.

As people's must-have devices, smartphones are developing towards intelligentization, miniaturization and multi-functions, thereafter requiring higher demands for PCBs that conform to all the functions of electronic devices. If you need a reliable PCB production partner to manufacture your smartphone PCBs, PCBCart can help. We have been providing quality guarantee full PCB production services for companies from telecommunications fields for 10 years. Our experience and experts allow you to get the best ever circuit boards at cost effective price.

Require bare board PCB fabrication and assembly service for telecommunication devices? Get your PCB price using our PCB quote system, it is super easy and totally FREE! Shall you have any questions on how PCBCart manufacture smartphone PCBs or electronic boards for other telecommunication applications? Contact our experts at anytime!

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Helpful Resources:
• How to Design High-Quality PCBs
• The Key PCB Design Rules You Have to Know
• Commonly Seen PCB Design Issues
• Possible Problems and Solutions in the Process of PCB Design
• Full Feature PCB Manufacturing Service from PCBCart - Multiple Value-added options
• Advanced PCB Assembly Service from PCBCart - Start from 1 piece

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Do you want to make a PCB board without files and just have the complete product ? Take it to us, we make it for you.
How did we do that ? I show you simple now.
This following thing we did, called PCB copy, also called PCB clone and PCB reverse engineering.
The first thing after we got it, is take two photos of two sides and record all the types of components, also the position, especially the position of diode and tiode.

The second thing is take down all the components and tins in PAD holes. Clean the PCB board and put it in scanner until get a clear image. Use the waterproof abrasive paper polish the top layer and put it in scanner again. Using PHOTOSHOP and scan it with colorful.

To make the circuit more clear, we adjusted contrast and intensity through PHOTOSHOP. Finally it’s clear enough now.

Change the .BMP file to .PROTEL file and leading-in this two files. If the position of PAD and VIA is coincident, it means we did it very well. If there is any deviation, repeat the last step. Untill it’s coincident. It means we succeed now.
Change the .BMP file to POT PCB, and draw circuit, according the second step, draw the position of components.
Last step is testing, finish it and you succeed on it.

About JY Electronic®

JY Electronic® is the established leader in providing innovative and reliable PCB & PCBA solutions for the electronic design industry. With over 20 years of experience in supplying high quality, on-time PCB & PCBA prototypes and mass production, JY Electronic is committed to improving production process for the design engineer from quote to delivery.
JY Electronic provides unparalleled customer service and leads the industry with a real On-Time Guarantee that is the first of its kind. For more information about JY's innovative PCB & PCBA solutions, or to learn more about quote and ordering process, please visitwww.JYcircuitboard.com

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